應用范圍/Application Data：
SMT底部填充、元件封裝、點錫膏、點紅膠、點黑膠、半導體封裝、晶元固定等
SMTunderfill,; Component packaging; Paste, red glue, black glue dotting;Semiconductor packaging; Chip fixing.
特點/ Feature：
? 采用電腦控制，WINDOWSXP操作系統，故障聲光報警及菜單顯示
PC control card, WINDOWS XP operate system,failure warning with menu.
? CCD視覺定位系統
CCD visual position
? 采用伺服馬達+滾珠絲桿驅動
Servo motor + screw drive
? 可任意搭載：噴射閥、螺桿閥、撞針閥、氣壓閥
Can be equipped with:Jetting nozzle, screw nozzle, Pin type nozzle, and pressure nozzle.
? 閥體自動恒溫系統，確保涂料的流動性一致
Automatic nozzle constanttemperature to make sure the consistencyof material liquidity.
? 可直接導入任何品牌的貼片機文件，也可在線視覺編程
Can lead in any Pick and Place system file, and also can be programmedin line.
? 可選配噴射閥或螺桿閥
Can choose with jetting nozzle or screw nozzle as option.
? 可選配激光高度檢測系統，工件變形后可自動校準Z軸高度
Can choose laser height detection system as option, and it can calibratethe component height automatically after the component’s shape changed.
? 可選配工件加熱系統，增強底部填充時涂料的流動性
Can choose board heating system as option to strength the materialliquidity when underfil
? 可選配精密測重系統，智能控制及檢測點膠量，確保點膠的一致性
Can choose accurate weighing system as option, intelligent control anddetect glue out amount, make sure the consistency when glue out
? 可選配雙軌道系統，不用等待進出板時間，大大提高效率
Can choose double conveyor system as option;Do not need to wait the board in-out time.
? 可選配傾斜旋轉系統，膠閥可自動傾斜35°，可360°任意旋轉（此功能只能搭載1套閥）
? 可選配大容量供料系統，減少添加或更換涂料的頻率，涂料容量自動檢測。
Can choose big capacity materialsystem as option, reduce the frequency of adding material, automatic detect thematerial amount.
功能配置/Functions | 技術參數及說明/ Specification |
整體式機架/Integral frame | 1200L 1270W 1600H (mm) |
全電腦控制/Whole PC control | 專用工業電腦/Special industrial PC |
CCD視覺定位/CCD vision position | 自動校準運行精度/Automatic calibrate working accuracy |
輸送軌道 Conveyor | 配高溫皮帶輸送,3段停板模式 /with high temperature belt conveyor, 3 section PCB stopping mode |
步進馬達輸送/ Stepper motor transfer | 20m/min |
自動調幅/Automatic adjust width | 單軌道/Single conveyor：50～450mm 雙軌道/Double conveyor：50～200mm 2套/set |
X、Y、Z驅動方式/X,Y,Z drive mode | 伺服馬達/Servo motor |
最高速度/Max. travel speed | 1000mm/S |
運行精度/Operation accuracy | 0.01mm |
點膠行程Dispensing area | X=450mm, Y=450mm,Z=50mm（帶加熱系統X=350mm,帶RZ=40mm） X=450mm,Y=450mm,Z=50mm /(with heating system，X=350mm,with RZ=40mm） |
膠閥數量/Nozzle Qty. | 1套（任選1套）/1 set（optional 1 set） |
閥體加熱/Nozzle heating | |
涂料容量/Material capacity | 30CC |
涂料檢測/Material detection | 自動檢測/Automatic detection |
閥嘴清洗裝置/Nozzle cleaning device | 真空清理/Vacuum cleaning |
輸入氣壓報警/Input pressure alarm | 菜單+聲光報警/menu+warning alarm |
掃描儀插口/Scanner port | 232插口/232 port |
通訊接口/Communication port | SMEMA |
編程模式/Program mode | 可導入任何貼片機文件或在線視覺編程 / Can lead in any Pick and Place system file, and also can be programmed in line. |
輸入電壓/Input power | 220V 50～60HZ |
氣壓/Pressure | 4kg/cm2 |
總功率/Total power | 3kw |
總重量/Total weight | 680kg |
安全標準/Compliance | CE |
選配項目/Option | |
工件加熱系統/Board heating system | 等待區上下加熱，工作區下加熱，室溫～150℃±3℃ Waiting area up/down heating, working area up/down heating, temp.～150℃±3℃ |
雙軌道系統/Double conveyor system | 無需等待進出時間，提高效率/No need to wait board in/out time |
激光測高/Laser height detection | 激光自動高度檢測，工件變形后可自動校準Z軸高度/Laser automatic height detection, automatic calibrate Z axis height after component’s shape changed. |
旋轉系統+傾斜螺桿閥/ Rotation system+tilt screw | Screw nozzle tilt 0-30°,360° rotation, strength the bond area between material and component. |
螺桿閥/Screw nozzle | 供膠穩定精準，維護方便/Steady and accurate glue supply |
撞針閥/Pin type nozzle | 液態涂料表面涂覆用/ Liquid material conformal coating |
噴射閥/Jetting nozzle | 最高點膠速度/Max. working speed：200/S/ |
精密測重系統/Precise height detect system | 誤差/Difference: 0.1mg |
大容量供料系統/Big capacity material supply | 300CC，自動檢測/Automatic detection |
